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	Name▼ / Code▼	Industry	Offer Price	Lot Size	Entry Fee	Closing Date	Grey Market Date▼	Listing Date▲
	REFIRE 02570.HK	Electrical Components & Equipment	145-165	20	3,333	2024/12/03	2024/12/05	2024/12/06
	Dmall 02586.HK	Application Software	30.21	100	N/A	2024/12/03	2024/12/05	2024/12/06

Summary

Established in 2005, we are a back-end semiconductor transport media manufacturer engaging in precision manufacturing on engineering plastics casings, in which we derived our revenue principally from the sales of tray and tray related products during the Track Record Period. Other than specialising in the design, development, manufacture and sales of tray and tray related products, we have also included carrier tape in our product categories since 2019. In addition to back-end semiconductor transport media, we are also provider of Micro-Electro-Mechanical-System (MEMS) and sensor packaging. According to the F&S Report, the market share of tray and tray related products was 31.3%, 31.8% and 31.7% in the back-end semiconductor transport media industry for the year ended 31 December 2021, 2022 and 2023 respectively. Among all the tray and tray related products manufacturers in the back-end semiconductor transport media industry, we ranked the third in the globe in 2023 in terms of sales revenue, with a market share of approximately 8.4%. Our back-end semiconductor transport media products, namely (i) tray and tray related products, which are containers which store semiconductor components during their production and delivery processes using mainly precision engineering plastics, and (ii) carrier tape, are mainly used for the protection of semiconductor devices, including power discrete semiconductor device, optoelectronic, IC and sensors, etc. Our tray and carrier tape with pockets formed in the tray or tape surface are designed for housing, safe handling, transport and storing different semiconductor devices, including power discrete semiconductor device, optoelectronic, IC and sensors and are ESD protective and highly thermal resistant. Our MEMS and sensor packaging provides an encasement designed to promote the electrical contacts that deliver signals to the circuit board of an electronic device and also to protect the MEMS and sensors from potentially damaging external elements and the corrosive effects of age. Supported by our R&D and material engineering department and sales and marketing personnel and customizable manufacturing platform and design enablement services, we are able to cater a great variety of customer-specific requests and ease up the timely completion of complex designs that are optimized in terms of cost and performance. During the Track Record Period, we had developed a diversified product portfolio of over 1,500 product specifications in various dimensions with different thermal, mechanical and physical properties metrics, which satisfy our customers’ specifications and required quality standards. The value chain of the semiconductor and integrated circuit industry is comprised of industry players in the upstream, midstream and downstream. Our Group is a supplier for upstream back-end functions of the semiconductor and integrated circuit industry (i.e. assembly, packaging and testing). For more details on the functions and value of back-end semiconductor transport media manufacturers, please refer to the section headed “Industry Overview – Global Semiconductor And Integrated Circuit (IC) Industry Overview – Value Chain” in this document. We set up two production factories in Dongguan, the PRC. As at the Latest Practicable Date, we had four production facilities, in which two of them are responsible for the manufacturing of tray and tray related products and each of the rest is responsible for production of carrier tape and MEMS and sensor packaging. According to the F&S Report, the global market size of back-end semiconductor transport media industry and MEMS and sensor packaging industry will respectively increase at a CAGR of 7.8% and 5.2% from approximately US$854.6 million and US$6.9 billion in 2024 to approximately US$1,156.1 million and US$8.5 billion in 2028, respectively. In order to capture the market growth for both back-end semiconductor transport media industry and MEMS and sensor packaging industry, we plan to increase our production capacities and capabilities by upgrading our production facilities in the PRC, in particular, purchasing automated machines and implementing production in the Philippines for carrier tape. Source: UBoT Holding (08529) Prospectus (IPO Date : 2024/05/24)
Listing Market	GEM
Industry	Semiconductors & Semiconductor Equipment
Background	Others
Major Business Area	N/A

Corporate Information

Substantial Shareholders	Tong Yuen To (37.68%) Tang Ming & Family (30.73%)
Directors	Tong Yuen To (Chairman and Chief Executive Officer and Executive Director) Chan Kai Leung (Financial Controller and Executive Director) Shek Kam Pun (Executive Director) Tam Ming Wa (Executive Director) Wong Tsz Lun (Non-Executive Director) Chan Oi Fat (Independent Non-Executive Director) Ma Jay Suk Lin (Independent Non-Executive Director) Wong Lok Man (Independent Non-Executive Director)
Company Secretary	Liu Ningyuan
Principal Bankers	The HongKong and Shanghai Banking Corporation Limited
Solicitors	Conyers Dill & Pearman King & Wood Mallesons KS Ng Law Office Mr. Lawrence Man Altum Law Corporation
Auditors	Moore CPA Limited
Registered Office	Unit 8, 35th Floor, Cable TV Tower, 9 Hoi Shing Road, Tsuen Wan, New Territories, Hong Kong
Share Registrars	Boardroom Share Registrars (HK) Ltd. [Tel: (852) 2153-1688]
Share Registrars Tel No	(852) 2153-1688
Internet Address	http://www.ubot.com.hk/
Email Address	[email protected]
Tel No	(852) 2691-8688
Fax No

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